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authorDamien Lespiau <damien.lespiau@intel.com>2013-08-20 14:20:06 +0100
committerDamien Lespiau <damien.lespiau@intel.com>2013-08-20 14:20:06 +0100
commit5b791671adc798486bb85213984e8e11094d19e3 (patch)
treef015e7e08051259776ed9911428a3c1180666fd7 /assembler
parentb5acc1061aad3c73a32b5ecc20fcb71067c938b8 (diff)
intel_infoframes: Be future-proof about showing 3D_Ext_Data
As Ville noted, future 3D_Struct must also send 3D_Ext_Data in the vendor infoframe. Signed-off-by: Damien Lespiau <damien.lespiau@intel.com>
Diffstat (limited to 'assembler')
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