Merge tag 'thermal-v5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux

Pull thermal control material for 5.19-rc1 from Daniel Lezcano:

 - Add the new k3 j72xx bangdap driver and the corresponding bindings (Keerthy)

 - Fix the missing of_node_put() in the SC iMX driver at probe timer (Miaoqian Lin)

 - Fix memory leak in __thermal_cooling_device_register() when device_register()
   fails by calling thermal_cooling_device_destroy_sysfs() (Yang Yingliang)

 - Add sc8180x and sc8280xp compatible string in the DT bindings and lMH support
   for QCom tsens driver (Bjorn Andersson)

 - Fix OTP Calibration Register values conforming to the documentation on RZ/G2L
   and bindings documentation for RZ/G2UL (Biju Das)

 - Fix type in kerneldoc description for __thermal_bind_params (Corentin Labbe)

 - Remove unneeded semi colon in libthermal and tools thermal as reported by
   cocci (Jiapeng Chong)

 - Fix potential NULL dereference in sr_thermal_probe() on Broadcom platform
   (Zheng Yongjun)

 - Add thermal library and thermal tools to encapsulate the netlink into event
   based callbacks (Daniel Lezcano)

 - Add change mode ops for the thermal-of sensor (Manaf Meethalavalappu
   Pallikunhi)

 - Fix non negative value support by preventing the value to be clamp to zero
   (Stefan Wahren)

 - Add compatible string and DT bindings for MSM8960 tsens driver (Dmitry
   Baryshkov)

 - Add hwmon support for K3 driver (Massimiliano Minella)

 - Refactor and add multiple generations support for QCom ADC driver (Jishnu
   Prakash)

 - Use platform_get_irq_optional() to get the interrupt on RCar driver and
   document Document RZ/V2L bindings (Lad Prabhakar)

* tag 'thermal-v5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (28 commits)
  thermal: k3_j72xx_bandgap: Add the bandgap driver support
  dt-bindings: thermal: k3-j72xx: Add VTM bindings documentation
  thermal/drivers/imx_sc_thermal: Fix refcount leak in imx_sc_thermal_probe
  thermal/core: Fix memory leak in __thermal_cooling_device_register()
  dt-bindings: thermal: tsens: Add sc8280xp compatible
  dt-bindings: thermal: lmh: Add Qualcomm sc8180x compatible
  thermal/drivers/qcom/lmh: Add sc8180x compatible
  thermal/drivers/rz2gl: Fix OTP Calibration Register values
  dt-bindings: thermal: rzg2l-thermal: Document RZ/G2UL bindings
  thermal: thermal_of: fix typo on __thermal_bind_params
  tools/thermal: remove unneeded semicolon
  tools/lib/thermal: remove unneeded semicolon
  thermal/drivers/broadcom: Fix potential NULL dereference in sr_thermal_probe
  tools/thermal: Add thermal daemon skeleton
  tools/thermal: Add a temperature capture tool
  tools/thermal: Add util library
  tools/lib/thermal: Add a thermal library
  thermal/drivers/thermal_of: Add change_mode ops support for thermal_of sensor
  thermal/drivers/bcm2711: Don't clamp temperature at zero
  thermal/drivers/tsens: Add compat string for the qcom,msm8960
  ...

1 files changed, 75 insertions, 0 deletions

diff --git a/tools/lib/thermal/sampling.c b/tools/lib/thermal/sampling.c
new file mode 100644
index 000000000000..ee818f4e9654
--- /dev/null
+++ b/tools/lib/thermal/sampling.c
@@ -0,0 +1,75 @@
+// SPDX-License-Identifier: LGPL-2.1+
+// Copyright (C) 2022, Linaro Ltd - Daniel Lezcano <daniel.lezcano@linaro.org>
+#include <errno.h>
+#include <stdio.h>
+#include <stdlib.h>
+#include <unistd.h>
+
+#include <thermal.h>
+#include "thermal_nl.h"
+
+static int handle_thermal_sample(struct nl_msg *n, void *arg)
+{
+	struct nlmsghdr *nlh = nlmsg_hdr(n);
+	struct genlmsghdr *genlhdr = genlmsg_hdr(nlh);
+	struct nlattr *attrs[THERMAL_GENL_ATTR_MAX + 1];
+	struct thermal_handler_param *thp = arg;
+	struct thermal_handler *th = thp->th;
+
+	genlmsg_parse(nlh, 0, attrs, THERMAL_GENL_ATTR_MAX, NULL);
+
+	switch (genlhdr->cmd) {
+
+	case THERMAL_GENL_SAMPLING_TEMP:
+		return th->ops->sampling.tz_temp(
+			nla_get_u32(attrs[THERMAL_GENL_ATTR_TZ_ID]),
+			nla_get_u32(attrs[THERMAL_GENL_ATTR_TZ_TEMP]), arg);
+	default:
+		return THERMAL_ERROR;
+	}
+}
+
+thermal_error_t thermal_sampling_handle(struct thermal_handler *th, void *arg)
+{
+	struct thermal_handler_param thp = { .th = th, .arg = arg };
+
+	if (!th)
+		return THERMAL_ERROR;
+
+	if (nl_cb_set(th->cb_sampling, NL_CB_VALID, NL_CB_CUSTOM,
+		      handle_thermal_sample, &thp))
+		return THERMAL_ERROR;
+
+	return nl_recvmsgs(th->sk_sampling, th->cb_sampling);
+}
+
+int thermal_sampling_fd(struct thermal_handler *th)
+{
+	if (!th)
+		return -1;
+
+	return nl_socket_get_fd(th->sk_sampling);
+}
+
+thermal_error_t thermal_sampling_exit(struct thermal_handler *th)
+{
+	if (nl_unsubscribe_thermal(th->sk_sampling, th->cb_sampling,
+				   THERMAL_GENL_EVENT_GROUP_NAME))
+		return THERMAL_ERROR;
+
+	nl_thermal_disconnect(th->sk_sampling, th->cb_sampling);
+
+	return THERMAL_SUCCESS;
+}
+
+thermal_error_t thermal_sampling_init(struct thermal_handler *th)
+{
+	if (nl_thermal_connect(&th->sk_sampling, &th->cb_sampling))
+		return THERMAL_ERROR;
+
+	if (nl_subscribe_thermal(th->sk_sampling, th->cb_sampling,
+				 THERMAL_GENL_SAMPLING_GROUP_NAME))
+		return THERMAL_ERROR;
+
+	return THERMAL_SUCCESS;
+}