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authorSrinivas Pandruvada <srinivas.pandruvada@linux.intel.com>2019-07-22 18:03:02 -0700
committerZhang Rui <rui.zhang@intel.com>2019-08-19 14:56:12 +0800
commitfdf4f2fb8e8990c131b2b1a5a9c03681bb16e87a (patch)
treecf9ce251d8cc839ead65cf5b24b2a3def93030f9 /tools/perf/scripts/python/bin
parentd1abaeb3be7b5fa6d7a1fbbd2e14e3310005c4c1 (diff)
drivers: thermal: processor_thermal_device: Export sysfs interface for TCC offset
This change exports an interface to read tcc offset and allow writing if the platform is not locked. Refer to Intel SDM for details on the MSR: MSR_TEMPERATURE_TARGET. Here TCC Activation Offset (R/W) bits allow temperature offset in degrees in relation to TjMAX. This change will be useful for improving performance from user space for some platforms, if the current offset is not optimal. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Tested-by: Benjamin Berg <bberg@redhat.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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